- Own system-level thermal design from early concept through production, optimizing airflow, heatsinks, cold plates, heat exchangers, and liquid cooling hardware for very high-power GPUs, CPUs, VRs, and memory.
- Design direct-to-chip liquid cooling solutions (cold plates, manifolds, tubing, quick-disconnects), support hybrid platforms, and own airflow design including fan selection, ducting, zoning, and impedance reduction.
- Perform thermal and CFD modeling to guide placement and layout, instrument systems for validation, execute characterization and margin testing under real AI workloads, and correlate simulation with lab data.
- Lead thermal bring-up across EVT/DVT/PVT, debug hotspots, instability, and flow anomalies, and drive root-cause analysis with permanent fixes through factory ramp and field deployment.
- Work closely with mechanical, hardware, power, firmware, SI, and manufacturing teams to ensure thermal considerations are embedded into board layouts, mechanical stackups, and rack packaging; set thermal methodology and mentor engineers.
Requirements
- Bachelor's or Master's in Mechanical Engineering, Thermal Engineering, or a related discipline.
- 10+ years of hands-on thermal design for servers, GPU platforms, HPC systems, or high-power electronics, with proven delivery of air-cooled and/or liquid-cooled systems into production and direct involvement in bring-up, validation, and manufacturing ramp.
- Hyperscale deployment experience strongly preferred.
- Strong hands-on knowledge of airflow and thermal design for high-power servers, direct-to-chip liquid cooling systems, cold plates/pumps/manifolds/heat exchangers, and CFD/thermal modeling tools; deep understanding of thermal-power-reliability relationships in AI/GPU systems.
- Strong individual contributor able to own problems end-to-end, comfortable debugging physical systems in the lab, and a clear communicator who translates thermal data into actionable design changes.
Core Competencies
Demonstrates expertise in system-level thermal design, including airflow optimization and liquid cooling solutions for high-power electronics. Proficient in thermal modeling and validation, with a strong focus on collaboration across engineering teams to ensure effective thermal methodologies.
Highest-signal resume keywords
- Thermal Design Engineering
- CFD Modeling
- Liquid Cooling Systems
- Airflow Optimization
- Thermal Methodology Development
ATS Optimization Keywords
Hard Skills
- Thermal Design
- CFD Modeling Tools
- Liquid Cooling Solutions
- Air-Cooled Systems
- High-Power Electronics
- Thermal Validation
- Debugging Physical Systems
- Thermal-Power-Reliability Relationships
- Characterization Testing
- Root-Cause Analysis
Soft Skills
- Clear Communication
- Problem Ownership
- Mentoring Engineers
Certifications & Qualifications
- Bachelor's in Mechanical Engineering
- Master's in Thermal Engineering
Industry Keywords
- High-Power GPUs
- HPC Systems
- Hyperscale Deployment
- Direct-to-Chip Cooling
- Manufacturing Ramp