Role: Principal Process Development Engineer
Job Type: Full-time / FTE / Direct Hire
We are seeking an experienced Principal Process Development Engineer to support semiconductor backend assembly and package development, with a focus on RF Power products.
Key Responsibilities:
- Develop and improve backend assembly processes and package technologies for RF Power products.
- Define process specifications, develop process recipes, select materials, and support equipment upgrades.
- Identify potential process, material, and equipment issues and develop effective solutions.
- Drive continuous improvement initiatives focused on quality, process efficiency, reliability, and cost reduction.
- Design and develop customized tooling for high-volume manufacturing equipment.
- Lead verification and qualification activities for new tooling, equipment, and materials.
- Work with equipment vendors, subcontractors, and internal engineering teams to qualify, troubleshoot, and optimize equipment.
- Create and maintain process and equipment FMEA documentation.
- Provide technical support to manufacturing teams, including troubleshooting and root-cause analysis.
- Support new product introductions through material selection, process development, and technical data analysis.
- Conduct risk assessments, develop mitigation plans, and communicate project progress and results to leadership.
- Support mechanical reliability testing and failure analysis to identify root causes.
Required Qualifications:
- Bachelor’s or Master’s degree in Mechanical Engineering, Materials Engineering, Industrial Engineering, Applied Science, or a related field.
- 8+ years of relevant experience in semiconductor package and assembly process development.
- Strong hands-on experience with backend assembly processes such as die attach, die bonding, and lid attach .
- In-depth knowledge of semiconductor backend assembly processes, particularly for RF Power packages .
- Experience with engineering methodologies including FMEA/DFMEA/PFMEA, SPC, Pareto Analysis, Control Charts, 8D, and DOE .
- Strong project management, documentation, communication, and problem-solving skills.
- Solid understanding of semiconductor reliability standards and test methodologies.
- Experience with materials characterization, reliability testing, and failure analysis is preferred.
- Experience supporting low-, medium-, and high-volume manufacturing of RF Power products is a plus.