We’re partnered with a well-funded, mission-driven microelectronics organization building next-generation RF and mixed-signal microsystems through advanced 3D heterogeneous integration and chiplet-based architectures. This team operates at the intersection of defense technology and commercial innovation, developing breakthrough platforms for communications, sensing, AI, and high-performance computing.
They are seeking a Senior RF Architect to lead the system-level design and development of millimeter-wave microsystems within advanced packaging environments.
What You’ll Do
- Architect RF and mixed-signal microsystems across K-band, Ka-band, and W-band for high-performance communications, radar, and sensing applications
- Define RF front-end architectures including LNAs, PAs, mixers, phase shifters, and T/R modules optimized for advanced 3D packaging flows
- Drive RF, thermal, and mechanical co-optimization across heterogeneous multi-die systems
- Lead EM and circuit co-simulation using tools such as HFSS, ADS, AWR, or CST
- Oversee RF testing and characterization at wafer, die, and module levels, including calibration, de-embedding, and automation strategies
- Collaborate with foundry, EDA, and packaging partners to shape next-generation RF integration technologies
- Develop technical documentation and reference designs to accelerate platform adoption
Required Qualifications
- PhD or MS in Electrical Engineering, Applied Physics, or related RF/microwave discipline
- 8+ years of hands‑on RF/millimeter‑wave design and validation experience
- Deep expertise in S-parameters, on‑wafer measurements, and high‑frequency characterization
- Strong proficiency with RF simulation and EM modeling tools
- Experience navigating packaging‑level electromagnetic challenges
- Proven ability to correlate simulation to measured performance
- Ability to work cross‑functionally in fast‑paced R&D environments
Preferred Qualifications
- Antenna‑in‑Package (AiP), SiP, RFIC, or 3D‑stacked RF module experience
- Familiarity with advanced heterogeneous integration workflows
- Exposure to GaN, GaAs, SiGe, or CMOS RF technologies
- Millimeter‑wave publications or patents
- Experience with advanced test environments such as wafer‑level, thermal, or cryogenic characterization
Why This Opportunity
- Long‑term funding and strong institutional backing
- Ownership of full RF system architecture rather than isolated blocks
- Work on next‑generation high‑frequency microsystems with real‑world impact
- Exposure to both defense‑grade and commercial‑scale technologies