We are seeking a Principal Mechanical Engineer with deep expertise in electronics packaging to lead the mechanical architecture and development of next-generation industrial electronic systems. This is a highly visible technical leadership role focused on designing robust, manufacturable, and reliable hardware solutions operating in demanding industrial environments.
You will work closely with electrical, systems, manufacturing, and reliability engineering teams to develop products from concept through production, driving mechanical innovation while ensuring performance, reliability, thermal efficiency, and manufacturability.
Responsibilities:
- Lead the mechanical design and packaging architecture of complex electronic products and subsystems.
- Develop enclosure, chassis, card-cage, and module-level designs for industrial applications.
- Drive thermal management solutions including conduction, convection, and passive cooling strategies.
- Design for harsh operating environments including shock, vibration, dust, moisture, and temperature extremes.
- Perform tolerance analysis, structural analysis, and mechanical validation activities.
- Collaborate with electrical engineering teams on PCB integration, connector selection, cable routing, EMI/EMC considerations, and system-level packaging.
- Partner with manufacturing and supply chain teams to ensure designs are optimized for cost, quality, and scalability.
- Oversee prototype builds, testing, design verification, and production release activities.
- Mentor junior engineers and provide technical leadership across multidisciplinary project teams.
- Support supplier engagement, design reviews, and technical decision-making throughout the product lifecycle.
Required Qualifications:
- Bachelor's degree in Mechanical Engineering or related discipline.
- 7+ years of experience in mechanical design and electronics packaging.
- Proven experience developing industrial, embedded, or electronic hardware products from concept through production.
- Strong proficiency with 3D CAD tools such as SolidWorks, Creo, or NX.
- Experience designing electronic enclosures, chassis, sheet metal, machined components, and assemblies.
- Strong understanding of thermal management, heat transfer, and reliability engineering principles.
- Experience with DFM, DFA, GD&T, tolerance stack-up analysis, and manufacturing processes.
- Knowledge of environmental qualification requirements including shock, vibration, ingress protection, and thermal testing.
- Excellent communication skills and ability to lead cross-functional engineering efforts.
Preferred Qualifications:
- Experience with ruggedized industrial, energy, automation, transportation, or telecommunications systems.
- Familiarity with finite element analysis (FEA) and thermal simulation tools.
- Knowledge of EMI/EMC design considerations and shielding techniques.
- Experience supporting products through regulatory and compliance testing.
- Prior technical leadership or principal-level engineering experience.