Principal Engineer, Digital and Mixed-Signal (6623)

Overview Of Role

TSMC’s Analog and Mixed‑Signal team is looking to hire a digital and mixed‑signal designer with experience in AI implementation to study machine learning in feedback control systems, high‑speed digital to analog converters, and SoC power management. The candidate is expected to have solid knowledge and understanding of digital and mixed‑signal fundamentals in advanced CMOS nodes. Experience implementing machine‑learning architectures is a must. Good understanding of MOS device physics is a must. You will report to the Department Manager of the Advanced Connectivity Department in Austin, Texas. We are currently operating in a hybrid work schedule with 4 days in office.

Responsibilities

• Select and architect machine‑learning in feedback control systems for Internet‑of‑Things applications.
• Develop digital functions such as calibration and data processing for high‑speed converters.
• Have the skills to write RTL, run verification, support APR engineers, and do sign‑off timing and physical verification.
• Integrate digital functions in mixed‑signal circuits.

Minimum Qualifications

• PhD degree with 6+ years or MS with 10+ years of industry experience in digital and mixed‑signal design
• Experience working with machine‑learning architectures
• Experienced with Verilog or SystemVerilog RTL design
• Experience running front‑to‑back suite of digital integration tools such as VCS, Verdi, Design Compiler, Fusion Compiler, Innovus, Primetime, StarRC, Formality or equivalent tools.
• Good top‑down design knowledge and experience (deriving specification, system architecture, circuit design, layout and post layout verification and validation)
• Experience with control theory and feedback
• Good understanding of advanced semiconductor manufacturing processes
• Knowledge of test and characterization of mixed‑signal circuits in the lab
• Scripting in TCL, Python, or Perl

Preferred Qualifications

• SoC power management and modeling
• Understanding of advanced packaging techniques
• SoC
• Good time management skills
• Good communication and documentation skills
• Good people skills and positive attitude

Diversity statement

TSMC Technology, Inc. is committed to employing a diverse workforce and provides Equal Employment Opportunity for all individuals regardless of race, color, religion, gender, age, national origin, marital status, sexual orientation, gender identity, status as a protected veteran, genetic information, or any other characteristic protected by applicable law. TSMC is an equal opportunity employer prizing diversity and inclusion. We are committed to treating all employees and applicants for employment with respect and dignity. If you require reasonable accommodation due to a disability during the application or the recruiting process, please feel free to notify us at TSMC confirms to all applicants its commitment to meet TSMC’s obligations under applicable employment law. Reasonable accommodations will be determined on a case‑by‑case basis.

Pay Transparency / Benefits Statement

At TSMC, your base pay is only part of your overall total compensation package. At the time of this posting, this role typically pays a base salary between $123,500and $176,500 per year. The range displayed reflects the minimum and maximum target for new hires. Actual pay may be more or less than the posted range. Factors that influence pay include the individual's skills, qualifications, education, experience and the position level and location. TSMC’s total compensation package consists of market competitive pay, allowances, bonuses, and comprehensive benefits. We also offer extensive development opportunities and programs.