Micron Technology, Inc. in Boise, Idaho seeks a Principal Engineer to lead packaging technology roadmaps and investment priorities, applying deep technical and cost-analytic insight to guide well-balanced trade-offs in performance, scalability and total cost of ownership.
Based at the Boise campus, you will shape strategy and drive innovative solutions across packaging platforms. You will collaborate with global R&D, suppliers and manufacturing teams to influence senior management decisions,
#J-18808-LjbffrPrincipal Engineer: Advanced Packaging Innovation in boise at Unknown Company
This position is listed as full time and onsite.