Responsibilities
- Lead schematic design, component selection, and power-tree definition for complex server and data‑center boards.
- Define system architecture, high‑speed interface requirements, power delivery strategy, and thermal/mechanical constraints.
- Develop boards and systems supporting CPUs, accelerators, memory subsystems, high‑speed IO, and advanced power architectures.
- Work closely with Taiwan ODMs on design reviews, issue resolution, schedule alignment, and manufacturing readiness.
- Support customer technical discussions, requirements gathering, and design‑in activities.
- Collaborate with SI/PI teams to ensure compliance for PCIe, CXL, Ethernet, UCIe, CPO, and other high‑speed links.
- Lead board bring‑up, debug, and system‑level validation using scopes, logic analyzers, and protocol analyzers.
- Partner with packaging, SI/PI, firmware, and mechanical teams to deliver fully integrated systems.
- Drive DFM/DFT reviews, support factory builds, and resolve production issues with ODM partners.
Requirements
- B.S./M.S. in Electrical Engineering or related field
- 8+ years of experience in board design and system‑level hardware development
- Strong background in server, data‑center, or high‑performance compute platforms
- Expertise in schematic capture, power architecture, and high‑speed digital design
- Experience working directly with Taiwan ODMs (Quanta, Wistron, Inventec, Foxconn, etc.)
- Familiarity with PCIe, CXL, DDR, Ethernet, CPO, and other high‑speed interfaces
- Hands‑on experience with lab equipment (oscilloscopes, logic analyzers, protocol analyzers)
- Ability to lead cross‑functional technical discussions with customers and partners
- Knowledge of SI/PI fundamentals is a plus
- Experience with server‑class power delivery (VRMs, multiphase regulators) is a plus.
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