Principal Application Engineer – Semiconductor Advanced PackageYou will join our business unit, working with advanced packaging materials (adhesives, sealants, functional coatings) targeted at the semiconductor industry. You will contribute to innovation, process excellence, and customer impact through deep technical support, application development, and troubleshooting in advanced packaging markets. As a Principal Application Engineer, you will lead on both developmental and commercial products in semiconductor advanced packaging.
You will serve as a technical authority on material application processes (wafer-level encapsulation, molding, etc.), collaborate with customers to solve process challenges, and drive adoption of new and existing solutions with clear value. You will engage across R&D, manufacturing, and customer sites to ensure products meet performance requirements and are successfully integrated into customer processes.Key Responsibilities / DutiesServe as technical lead for advanced packaging product lines: troubleshoot, optimize, and validate material application processesProvide deep application knowledge in semiconductor packaging (2.5D, 3D, via, interposer, etc.)Interface directly with customers to resolve product- or process-related issues, working hands-on to test and develop solutionsDesign experiments, run tests, and analyze data for material behavior, reliability, and process compatibilityEnsure new and existing products deliver quantifiable value to customers (yield, throughput, cost)Solve fundamental technical challenges across product families using client approachesCollaborate with internal teams (R&D, process engineering, quality, manufacturing) to transfer successful technologiesMaintain expertise on industry trends in advanced packaging, materials, and processesTravel to customer sites or partner locations (up to ~10%) as neededRequired Qualifications & SkillsBachelor's degree in Materials Science / Engineering, Chemical Engineering, Mechanical Engineering, or related field10+ years experience in semiconductor advanced packaging environment (materials, adhesives, encapsulants, molding)Strong understanding of 2.5D / 3D packaging, wafer-level encapsulation, molding, underfills, interconnects, etc.Proven track record in taking a product from development through customer implementationStrong experimental design, analytical, problem-solving, and characterization skillsExcellent verbal and written communication, able to interact with customers and present in group settingsAbility to work independently and cross-functionally in a fast-paced environmentHigh ownership, customer-oriented mindset, and ability to translate customer needs into technical solutionsProficiency with project management, time management, and meeting deliverablesWillingness to travel up to 10%