Renesas Electronics in San Jose is seeking a Principal Package Design Engineer to lead next-generation packaging for high-performance semiconductors. You will drive architecture, simulation, and qualification, interfacing with design, manufacturing, and suppliers to ensure robust, scalable solutions.
The role emphasizes hands-on development, collaboration across teams, and leadership in packaging initiatives, with opportunities to influence AI infrastructure and data center power applications.
#J-18808-LjbffrPrincipal Advanced Packaging Engineer (Hybrid) in san jose at Unknown Company
This position is listed as full time and onsite.