Renesas Electronics is seeking a senior leader to drive package technology development for AI and data center power products. You will coordinate with OSATs for new package development, qualification, and production transfer, while managing budgets and customer adoption programs.
The role requires extensive experience in power SiP/modules, wafer-level packaging, flip-chip methods, and advanced substrates, with a track record in leading cross-functional teams and delivering on aggressive
#J-18808-LjbffrPower Packaging Design & NPI Lead in tempe at Unknown Company
This position is listed as full time and onsite.