Unknown Company

Photonics Packaging Integration Engineer (2.5D/3D)

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essex junction, vt • Posted Today
Onsite Full Time Engineering

GlobalFoundries U.S. INC.

seeks a hands-on assembly integration professional to deliver electro-optical transceivers using GF’s Photonix platform and advanced packaging 2.5D/3D modalities. The role focuses on tool-process interactions for SiPh Flip Chip assembly, emphasizing product and module reliability, packaging design rules, materials selection, and reliability qualifications for chiplet/module packages.

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Photonics Packaging Integration Engineer (2.5D/3D) in essex junction at Unknown Company

This position is listed as full time and onsite.

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