AMD Austin is seeking an advanced packaging technology leader to drive panel-scale packaging for data center and AI accelerator products. You will own technology direction, coordinating with foundries, OSATs, substrates, materials, and equipment partners to deliver materials, processes, design rules, and DFx guidelines from concept to high-volume manufacturing.
You will lead cross-functional teams across geographies, communicate progress to executive leadership, and drive risk mitigation and
#J-18808-LjbffrPanel-Scale Packaging Director for AI Data Centers in austin at Unknown Company
This position is listed as full time and onsite.