Advanced Micro Devices (AMD) in Austin, TX seeks a Package-centric Mechanical Modeling Architect to define and drive next-generation packaging-platform architectures. You will develop, validate, and apply mechanical and multi-physics models guiding architecture across package, board, and cooling solutions for data center and HPC systems.
The role requires ownership of modeling rigor, collaboration across silicon, package, board, and manufacturing teams, and influence on product roadmaps with a
#J-18808-LjbffrPackaging Systems Architect: Multi-Physics for Data Center in austin at Unknown Company
This position is listed as full time and onsite.