OpenAI is seeking an Advanced Packaging Reliability Engineer based in San Francisco to lead reliability engineering for advanced AI packages. In this role, you will assess and optimize package reliability, working closely with multi-functional teams to predict package behavior and improve overall robustness, while developing innovative testing methodologies.
Ideal candidates will have significant experience in semiconductor package reliability, thermal modeling, and demonstrate strong problem-solving skills. Competitive compensation ranges from $266K to $445K plus equity offerings.
#J-18808-LjbffrPackaging Reliability Engineer - AI HPC, Equity in san francisco at Unknown Company
This position is listed as full time and onsite.