Intel Corporation's Advanced Packaging Technology Manufacturing (APTM) team in Chandler, AZ seeks a Packaging Module Development Engineer to develop, optimize, and qualify advanced semiconductor packaging processes for high-volume production.
You will lead experiments, specify materials and equipment, and collaborate with manufacturing and product teams to enable reliable, cost-effective packaging solutions.
#J-18808-LjbffrPackaging Process Engineer – Advanced Semiconductors in northern at Unknown Company
This position is listed as full time and onsite.