Intel is seeking a Mechanical Engineer for the Advanced Packaging Mechanical Analysis team in Chandler, AZ. This position focuses on developing advanced finite element analysis simulations for semiconductor packaging, requiring regular onsite presence.
The ideal candidate will possess a PhD in Mechanical Engineering and relevant experience in thermal-mechanical research and Finite Element Analysis tools. The role offers a competitive salary and benefits package, reflecting the industry's best. #J-18808-Ljbffr
The ideal candidate will possess a PhD in Mechanical Engineering and relevant experience in thermal-mechanical research and Finite Element Analysis tools. The role offers a competitive salary and benefits package, reflecting the industry's best. #J-18808-Ljbffr
Packaging Multiphysics Simulation Engineer in phoenix at Unknown Company
This position is listed as full time and onsite.