Intel Corporation in Chandler, Arizona is seeking a Senior Packaging Module Development Engineer to advance semiconductor packaging processes and equipment for the next-generation roadmap. The role requires hands-on collaboration in state-of-the-art labs, on-site, to develop advanced assembly processes and drive reliability testing simulations.
You will lead cross-functional efforts in process qualification, equipment integration, DOE/SPC studies, and data-driven problem solving, coordinating
#J-18808-LjbffrPackaging Module Equipment Engineer - Advanced IC Packaging in phoenix at Unknown Company
This position is listed as full time and onsite.