Intel Corporation in Phoenix, AZ, seeks an Advanced Packaging Development Engineer to design, optimize, and qualify packaging processes and materials for high-volume manufacturing. You will drive reliability, yield, and cost improvements while advancing next-generation semiconductor packaging technologies.
The role requires collaboration across matrixed teams, hands-on process development, and strong data analysis. A hybrid work model is offered with competitive compensation and benefits.
#J-18808-LjbffrPackaging Innovation Engineer – Advanced Packaging in phoenix at Unknown Company
This position is listed as full time and hybrid.