Applied Materials, Inc. in Santa Clara is seeking an Advanced Packaging Integration Engineer to lead process integration for high‑performance interconnects and micro‑LED panels. You will architect robust, scalable integration flows that meet manufacturability and reliability requirements while collaborating with fabs, OSATs, suppliers, and cross‑functional teams across design, process, integration, and metrology.
The role requires a Ph.D. or M.S.
#J-18808-LjbffrPackaging Innovation Architect: 2.5D/3D Hybrid Bonding in santa clara at Unknown Company
This position is listed as full time and onsite.