Intel is seeking an experienced engineer to develop assembly processes and equipment for the company's packaging roadmap. You will optimize manufacturing efficiency to meet quality, reliability, cost, yield and productivity targets.
The role requires strong experience with semiconductor processes, DOE and SPC, plus project leadership to drive time-critical technical projects. The position is on-site in the Phoenix area and carries a competitive compensation package. #J-18808-Ljbffr
The role requires strong experience with semiconductor processes, DOE and SPC, plus project leadership to drive time-critical technical projects. The position is on-site in the Phoenix area and carries a competitive compensation package. #J-18808-Ljbffr
Packaging Equipment & Process Innovation Engineer in phoenix at Unknown Company
This position is listed as full time and onsite.