1000 Micron Technology, Inc. in Boise, ID is seeking an experienced engineer to define and explore advanced package architectures for next-gen memory systems. You will perform critical trade-off studies, create hands-on package designs, and run simulations for SI/PI and thermal analysis.
The ideal candidate has over 10 years of experience in package design with a Bachelor’s degree in Engineering. The position offers a competitive salary range of $177,000 - $387,000, along with comprehensive benefits that include medical, dental, vision plans, and paid time-off.
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