Intel's Advanced Packaging Technology Development Substrate and Wafer Assembly (APTD SWA) organization seeks a Module Engineer On Shift to provide real-time factory support, addressing equipment and process issues and ensuring continuous 24/7 lot movement on the production line in Phoenix.
The MEOS role emphasizes troubleshooting, RFCs, tool enablement, and collaboration across engineering teams, with opportunities to impact packaging technology and product quality in a fast-paced semiconductor #J-18808-Ljbffr
The MEOS role emphasizes troubleshooting, RFCs, tool enablement, and collaboration across engineering teams, with opportunities to impact packaging technology and product quality in a fast-paced semiconductor #J-18808-Ljbffr
On-Shift Module Engineer, Advanced Packaging Tech in phoenix at Unknown Company
This position is listed as full time and onsite.