Next-Gen, High-Speed HBM, LPDDR Memory Subsystem ASIC Digital Design Engineer

Job TitleSenior ASIC Design EngineerCompanyQualcomm Technologies, Inc.Job AreaEngineering Group, Engineering Group > ASICS EngineeringGeneral SummaryNext Generation, High-Speed, Memory and Cache Controller and Advanced Memory NoCs based Subsystem Design Team is looking for a Senior ASIC Design Engineers for the next generation high speed HBM/LPDDR/DDR memory subsystems. The front end of the DDR controller interfaces to the rest of the system such as CPU, GPU, DSP, Multimedia Processors and the engineer is expected to be responsible for enabling high speed (1Ghz+) designs in QCT products.Job DescriptionThe candidate will work on architecture, design (RTL coding), and deployment of the next generation, high-speed memory subsystems into QCT products. You will develop or contribute to the development of architecture and design specifications and drive the micro-architecture of portions of the logic design. You will implement and deliver RTL and work with verification engineers to deliver high quality designs.

You will be responsible for debugging your designs and also provide debug support when integrated into the rest of the chip. Synthesis, Timing Closure, Physical Design Support, Gate Level Simulations, Power Analysis are expected to be key tasks. You will make regular contributions to the overall improvement in design methodology to drive productivity and quality of results.QualificationsBachelor's or Masters degree in Science, Engineering, or related field.5 + years ASIC design, RTL coding, front-end digital design experience3+ years Hardware Architecture experiencePreferred Qualifications3-10 years of ASIC design (RTL coding) PreferredExposure to RTL Design Verification flows is a plus3+ years of direct Hardware Architecture experienceBachelors degree in Electrical or Computer Engineering and at least 5+ years of experience in high speed digital design Master's degree preferredExperience with the following:LPDDR memory and cache controller, NoC based architectures especially the front end interfacing to the CPU, DSP, and multimedia processorsExposure to HBM memory type designsOn-chip tightly coupled SRAM & L3 cache controller architecture/designExperience with x86 or ARM CPU/bus architecturesOrdering of memory transactions and methods to enforce proper ordering in order to conform to ISA architecture specificationEducation RequirementsRequired: Bachelor's, Computer Engineering and/or Electrical EngineeringPreferred: Master's, Computer Engineering and/or Electrical EngineeringMinimum Qualifications:• Bachelor's degree in Science, Engineering, or related field and 4+ years of ASIC design, verification, validation, integration, or related work experience. ORMaster's degree in Science, Engineering, or related field and 3+ years of ASIC design, verification, validation, integration, or related work experience.

ORPhD in Science, Engineering, or related field and 2+ years of ASIC design, verification, validation, integration, or related work experience.Pay Range and Other Compensation & Benefits$140,000.00 - $210,000.00The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play.

Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.