Job TitleThis hands-on assembly integration role will deliver industry leading electro-optical transceivers using GF's Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form factors meeting customer requirements.A successful candidate would possess assembly expertise for photonic and electronic packages, with primary focus on the compatibility of photonic interconnect and packaging solutions with present state-of-the-art electrical interconnect solutions.Essential ResponsibilitiesDefines process integration specifications for assembly flow of co-packaged optics modules driving toward cost, yield, and reliability targets.Establishment of manufacturing driven design rules.Ensures that all packaged products meet a standardized set of quality expectations by driving through product packaging design reviews, materials selection and FMEAs of customer packaging concepts.Driving SiPh advanced packaging product innovations, design enablement for customers, and efficient manufacturing processes internally and with OSAT ecosystems.Provides tools and complex analysis of quality issues and associated financial implicationsProtects the business by ensuring that all necessary requirements are met and that the technology performs to the expectations of customers and market to avoid costly re-designs.Ensures standardization of site-based quality processes are executed appropriatelyDrives discipline and qualification robustness through a consistent global qualification processTypically performs one or more of the following in capacity of either an individual contributor (as directed and/or independently), or as a manager:Perform project management and data analysisIdentify and resolve process integration issues and related problemsDevelop custom or derivative processes to meet customer needsSupport new designs with module characterization and design rule developmentWork with cross function teams to resolve technical & yield concernsDevelop and improve test structures that enable fast and rigorous characterization of processDrive CIP (Continuous improvement plans) to deliver organizational goalsPerform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programsOther ResponsibilitiesPerform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.Required QualificationsMS, or PhD + 4 or more years of experienceExtensive experience with failure analysis, design of experiments, & packaging process integration.Experience in bringing packaged products from development into production.Strong written and spoken English communication skillsPreferred QualificationsMaterials science, thermal, mechanical, simulation background.Validated record of photonic and electrical interconnect innovation and product release internally or with an OSAT ecosystem.Expert in chip package interaction for 2D, 2.5D, 3D, 3.5D SiPh advanced packaging.Broad and deep knowledge of global technology and commercial trends related to current technology, design, or manufacturing, with growth into trends related to future technologies, design, or manufacturing.Expected Salary Range$94,300.00 - $175,100.00The exact Salary will be determined based on qualifications, experience and location.