Intel in the United States (Arizona, Phoenix) seeks an experienced ATTD Microelectronic Packaging Engineer to manage projects, design/develop packages, and sustain IC assemblies. You will lead DOE activities, support NPIs, and coordinate with Manufacturing on issues, ensuring data collection and process improvements on the floor.
The role emphasizes hands-on floor time, cross-functional collaboration, and ownership of quality excursions with strong documentation and teamwork. #J-18808-Ljbffr
The role emphasizes hands-on floor time, cross-functional collaboration, and ownership of quality excursions with strong documentation and teamwork. #J-18808-Ljbffr
Module Engineer - Semiconductor Assembly & NPIs in phoenix at Unknown Company
This position is listed as full time and onsite.