Micron Technology, a world leader in memory and storage, seeks a Senior Engineer/Principal Engineer/MT&S Design Architect for the Next‑generation HBM Architecture Team in the US. You will design, simulate, analyze and optimize 3D‑stacked high‑performance memories for AI workloads, collaborating with architecture and design peers.
Responsibilities include defining circuit implementations, technology requirements, thermal improvements, power delivery, and interfaces, with emphasis on
#J-18808-LjbffrMixed-Signal Design Architect for 3D HBM Memory in folsom at Unknown Company
This position is listed as full time and onsite.