Memory Packaging Engineer — High-Density, High-Bandwidth

Apple, Inc. in San Francisco, CA is seeking a Memory Packaging Engineer to architect memory solutions powering Apple's hardware performance.

You will drive the definition, development, and qualification of next-generation memory packages from concept to qualification, coordinating with memory partners and internal teams to enable bandwidth and density scaling. The role emphasizes packaging technology evaluation, warpage/CTE mitigation, and close collaboration with memory die design teams.