Apple, Inc. in the San Francisco Bay Area is seeking a Memory Packaging Engineer to architect memory solutions that power high-performance hardware. You will help push bandwidth, density, and system integration through careful co-design of memory tech and devices.
You will drive memory package roadmaps, collaborate with electrical, mechanical, and thermal teams, and guide vendor DOEs to ensure quality and reliability across next-generation packages.
#J-18808-LjbffrMemory Packaging Architect for High-Density Systems in san francisco at Unknown Company
This position is listed as full time and onsite.