Micron Technology, Inc in Boise, ID is seeking a Product Development Engineer 5 - Hardware Engineering MTS to define next-generation memory packaging architectures and to drive cross‑stack optimization across silicon, package, board, and system.
You will work with silicon, system design teams and customers, apply AI‑based multi‑physics methods, and help shape long‑term packaging strategy for edge‑AI and data center memory products.
#J-18808-LjbffrMemory Packaging Architect for Edge & Data Center AI in boise at Unknown Company
This position is listed as full time and onsite.