LFAB Process Integration Branch ManagerWorking in a state-of-the-art, growing 300mm, 65nm and below analog and embedded wafer fab in Lehi, Utah.In this role you will be part of the factory leadership and lead the Process Integration team, where primary responsibilities will include (a) ownership of parametric performance and yield improvement, (b) driving operational focus on parametric test output evaluation, (c) leading the process integration team in semiconductor device monitoring, device improvement activities, integration projects to support increased yield and product performance, (d) working closely with the factory leadership team to meet daily operational and strategic technology goals, (e) leading the factory in finding effective solutions to technology issues and yield improvement in a time constrained environment, (f) utilizing technical and practical experience to drive factory quality decisions and actions, (g) leveraging experience and management skills to ensure technology transfers and development meet commitments, (h) partnering with factory leadership to define and execute strategic roadmaps.As part of this role, you will have director level people responsibilities (manager of managers) and direct responsibility for continued improvement of the process integration team's effectiveness. As the Process Integration Branch Manager you are expected to be highly experienced in both semiconductor device physics and process integration as you will be required to both drive decisions and coach factory team members at all levels in devices, integration, project execution, and continuous improvement.Demonstrated Qualification:Effective director level leadership (experience leading managers and individual contributors): defining and meeting aggressive goals, strategic and tactical execution, team developmentEffective communication to senior management and overall organizationStrategic planning in a combined volume semiconductor manufacturing and new technology introduction environmentLeading technology development and transfer activities, both technical and executionDay to day leadership in a fast paced, 24x7 manufacturing site with a rapidly changing environment.Deep technical and practical understanding of semiconductor device physicsExpertise and ownership of semiconductor device characterization and manufacturing parametric data, 65nm and below.Expertise and ownership of semiconductor process integration in a manufacturing environment, 65nm and below.Practical understanding of 65nm-28nm process integrationExperience in 65nm and below process technology nodesGeneral knowledge of unit process physics and manufacturing operationsStrong analytical and problem-solving skillsStrong verbal and written communication skillsAbility to work in teams and collaborate effectively with people in different functionsDemonstrated ability to build strong, influential relationshipsWork effectively across organizational boundaries, fab sites, development teams, business unitsProcess Integration Branch Manager Responsibilities:Leadership team member responsible for "24x7" volume manufacturing fabrication facilityProactive alignment and communication with factory leadership teamFactory level goal definition and attainmentDefine and set process integration goals to support factory level goalsDeliver on daily tactical factory priorities (ownership of parametric performance and execution)Deliver on strategic factory prioritiesIdentify and drive longer term company technology and manufacturing group initiativesDefine, initiate and implement strategic initiatives to impact factory and TI technology and manufacturing group performanceOptimize the process integration and factory organization to its most effective state, with ongoing reassessmentLeadership in technology transfer and development activities including project execution, technical assessment, and communicationsLeader of process integration team covering all technologies released to manufacturingOwner of technology parametric performance/yield (all components and overall integration)Plan effectively, drive schedules, meet critical deadlines on multiple projects in parallelCoach and develop leaders and team in technical understanding, management, and project executionLead and drive technical discussions around the performance of a broad portfolio of semiconductor componentsLead and drive technical discussions around the process integration at 65nm and below nodesLead and coach team in critical, high pressure, time constrained technical problem-solving activitiesClearly communicate technology and project status and actions to senior management and overall organizationInterface with multiple organizations on a diverse team to accomplish goals.QualificationsMinimum requirements:Masters or PhD in EE/ECE or semiconductor specific solid state physics, applied physics or quantum mechanicsExperience working in a high-volume semiconductor factory with expertise in semiconductor devices and transition of new technology from introduction to production on schedule (high volume)Experience in a high-volume semiconductor factory as a device or process integration manager.About UsWhy TI?Engineer your future. 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If you are interested in this position, please apply to this requisition. TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.Job InfoJob Identification Job Category ManufacturingLocations 4000 N Flash Dr, Lehi, UT, 84048, US