Oracle US is seeking a skilled engineer or scientist to lead deployment and management of direct-to-chip liquid cooling technology with external manufacturing partners. You will ensure robust technical implementation, drive quality standards, oversee supplier collaboration, and support innovation of advanced thermal management solutions.
The role requires leading specifications, qualification, and mass production at external sites, ensuring adherence to safety and performance standards.
#J-18808-LjbffrLead Thermal Engineer, Direct-to-Chip Cooling in frankfort at Unknown Company
This position is listed as full time and onsite.