Lead Thermal Architect for AI Compute Platforms

Qualcomm Technologies, Inc. seeks a Principal Thermal Engineer to solve complex thermal challenges for the Dragonfly AI300 platform.

You will drive thermal architecture, validation, and optimization across silicon, packaging, and system levels, partnering with design and hardware teams to ensure peak performance and reliability. The role requires deep expertise in high-power electronics cooling, CFD tools, and hands-on testing, with strong communication and cross-functional leadership.