Apple Inc. is seeking a senior engineer to lead substrate package development, defining roadmaps and coordinating with foundries and OSATs to deliver high-performance package solutions for Apple products.
You will work with cross-functional teams to optimize architectures, manage risks, and address technical challenges across the entire development cycle. The role requires deep knowledge of substrate technology, manufacturing processes, and hands-on experience with Cu plating, lithography,
#J-18808-LjbffrLead Substrate Technologist – Packaging & Innovation in irvine at Unknown Company
This position is listed as full time and onsite.