Intel Corporation in Hillsboro, Oregon is seeking a Module Development Engineer to advance semiconductor manufacturing capabilities by developing and optimizing processes for next-generation devices, conducting feasibility studies, and enabling high-volume production.
You will collaborate across teams, use SPC and data analytics, and drive process innovations, with a Master's/PhD plus 2–4 years in semiconductor processing; on-site work model.
#J-18808-LjbffrLead Packaging Plating & Module Engineer in or at Unknown Company
This position is listed as full time and onsite.