Lead Package Design Architect – HPC Datacenter

Qualcomm Technologies, Inc. seeks a senior leader to guide the CHS Datacenter package design team, driving end‑to‑end architecture for high‑performance compute products.

You will own technology roadmaps, coordinate with silicon, platform, and manufacturing teams, and ensure performance, power, and cost targets are met. The role emphasizes deep expertise in multi‑chiplet packaging, HBM, silicon interposers, and high‑density substrates, with a focus on scalable design methodologies and executive