GlobalFoundries inc. is seeking a Packaging Integration Engineer to lead optical packaging architectures for silicon photonics modules, including fiber attach and photonic die placement. You will drive 2.5D/3D/3.5D HI packaging, work with OSATs, and optimize reliability through multiphysics simulations.
The role requires a Master’s degree and 8+ years in semiconductor packaging with strong communications skills. Travel up to 25% to GF facilities or partners is expected.
#J-18808-LjbffrLead Optical Packaging Engineer (SiPh & CPO) in essex at Unknown Company
This position is listed as full time and onsite.