SK hynix America is seeking a highly skilled and motivated Mechanical Simulation Engineer to join our Advanced Packaging (PKG) R&D team. You will drive the mechanical integrity of next‑generation packaging solutions (HBM, 2.5D/3D integration) using advanced numerical methods to predict thermo‑mechanical behavior in complex IC packages.
Collaborate with design and process teams to optimize warpage, solder joint reliability, and interfacial adhesion, and map system‑level interactions to board and
#J-18808-LjbffrLead Mechanical Simulation Engineer – Packaging in san jose at Unknown Company
This position is listed as full time and onsite.