Colwyn Group is actively seeking a Principal Laser Packaging Engineer in the San Francisco Bay Area, CA. The role centers on owning the laser package architecture for high-power PCSELs, guiding dies from concept to manufacturable, taped-out packages.
Responsibilities include thermal path design, die-attach strategy, and hardware integration to meet stringent performance specs. Requires experience in optoelectronic packaging and strong thermo-mechanical understanding for reliable device lifetime.
#J-18808-LjbffrLead Laser Packaging Engineer – High-Power PCSELs (Hybrid) in san francisco at Unknown Company
This position is listed as full time and onsite.