Apple Inc. in the San Francisco Bay Area seeks an IC Packaging Engineering Lead to drive package integration and architecture with cross-functional Silicon, Packaging, and Systems teams.
You will shepherd packaging concepts from development through high-volume manufacturing, collaborating with OSATs and assembly partners to deliver cost‑effective, high-performance solutions. The role requires a strong technical foundation in semiconductor packaging, a track record of delivering complex packages,
#J-18808-LjbffrLead IC Packaging & Integration Engineer in san francisco at Unknown Company
This position is listed as full time and onsite.