Lead Hardware Engineer – Advanced Co-Packaged Optics

Broadcom Inc. seeks a Technical Lead for Advanced Co-Packaged Optics (CPO) to drive end-to-end hardware development—from concept to mass production.

You will lead cross-functional teams spanning photonics, electronics, mechanical, firmware and software to meet aggressive performance, cost, and schedule goals. The role requires 12+ years in engineering or 10+ with a Master's (or 7+ with a PhD) and deep expertise in photonic/electronic IC design, optical engine packaging, and substrate/PCB