Samsung Austin Semiconductor is seeking a Copper-to-Copper (C2C) Bonding Expert to lead development, optimization, and integration of advanced wafer bonding technologies for next-generation CIS. You will drive innovations in hybrid bonding to enable stacked image sensors with improved yield and reliability, on-site in Austin.
The role requires 5+ years in Far BEOL/Module Integration and 3+ years in Bonding, with up to 10+ years in related areas.
#J-18808-LjbffrLead C2C Bonding Engineer - Hybrid Wafer Integration in austin at Unknown Company
This position is listed as full time and hybrid.