Intel Corporation in the United States (Arizona, Phoenix) seeks a Semiconductor Packaging Integration Research Manager to lead advanced packaging integration research for next-generation heterogeneous tech. You will guide architecture, chiplet assembly, substrate/interposer tech, and reliability across teams.
You will define research strategy, manage a multidisciplinary team, and drive feasibility, prototyping, and readiness assessments, partnering with design, process, materials, and
#J-18808-LjbffrLead, Advanced Packaging & Chiplet Integration in chandler at Unknown Company
This position is listed as full time and onsite.