Renesas Electronics Corporation is seeking a Principal Package Design Engineer to lead development and integration of next-generation packaging solutions for high-performance semiconductors. The role emphasizes advanced package architecture, simulation, OSAT strategy, cross-functional collaboration, and qualification from concept to high-volume production.
The ideal candidate has extensive experience in semiconductor packaging, strong CAD/simulation skills, and a track record of delivering
#J-18808-LjbffrLead, Advanced Package Design Engineer (Hybrid) in austin at Unknown Company
This position is listed as full time and onsite.