Renesas is seeking a Principal Package Design Engineer to lead next-generation packaging solutions for high-performance semiconductors. The role focuses on advanced package architectures, assembly processes, thermal/mechanical reliability, and cross-functional collaboration with design, applications, product engineering, and manufacturing teams.
The ideal candidate will have deep expertise in packaging technologies, 5+ years of experience, and a track record of bringing complex products from
#J-18808-LjbffrLead Advanced IC Packaging Engineer: 2.5D/3D, SiP, Power in austin at Unknown Company
This position is listed as full time and onsite.