Broadcom Inc. is seeking an Advanced Package Technology Engineer to develop cost-effective, high-performance 2.5D/3D packaging solutions.
The role involves close collaboration with silicon, packaging, design, and supplier teams to meet ambitious timelines and performance goals. The candidate should have hands-on 4–6 years in 2.5D/3D development, strong knowledge of substrates, interposers, and related processes, and proven project management and collaboration skills.
#J-18808-LjbffrLead 2.5D/3D Advanced Package Engineer in fort collins at Unknown Company
This position is listed as full time and onsite.