- Architect next-generation AI data center infrastructure spanning power, cooling, networking, and compute.
- Define technology roadmap for 800V HVDC power distribution and liquid cooling integration at rack scale.
- Lead cross-functional design Examine with hardware vendors (NVIDIA, AMD, Intel) and facility teams.
- Establish end-to-end lifecycle standards from design opinion commissioning to decommissioning.
- Drive cost, reliability, PUE, and scalability optimization across global deployments.
Requirements
- Understanding of liquid cooling technologies (cold plate, immersion) at 100kW+/rack density.
- Familiarity with NVIDIA AI infrastructure (GB200 NVL72, DGX, Spectrum-X networking).
- Experience with Infrastructure as Code (Terraform, Ansible) for DC block management.
- Excellent cross-team collaboration skills with track record of vendor co-development.
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