Apple Inc. in Cupertino, California, seeks a Thermal Architect to design and optimize thermal solutions for mobile devices. You will lead CFD and heat transfer analyses across silicon and packaging, collaborating with silicon design, system thermal, and debug teams to ensure robust thermal performance.
A Master’s in Mechanical Engineering and 4+ years of experience are expected. The role offers comprehensive benefits, stock participation, relocation options, and growth opportunities within
#J-18808-LjbffrIC Packaging Engineer — Thermal Solutions Architect in cupertino at Unknown Company
This position is listed as full time and onsite.