Rivian Automotive is seeking an IC Package Design Engineer to lead physical layout, modeling, and analysis of advanced semiconductor packaging solutions for high-performance ICs. You will collaborate with IC Design, SI/PI, PCB Layout, Mechanical, Thermal, and Test teams, plus OSAT partners, to deliver robust packaging from concept to production.
Responsible for end-to-end layout, advanced packaging methods (FCBGA, SiP, 2.5D/3D), co-design with silicon and board teams, and ensuring DFM/DFT
#J-18808-LjbffrIC Package Design Engineer - 2.5D/3D Packaging Expert in irvine at Unknown Company
This position is listed as full time and onsite.