Intel Corporation in Arizona seeks an experienced Packaging Module Development Engineer to design and optimize packaging processes, materials, and equipment for next‑generation semiconductor technologies. You will drive reliability, manufacturability, and performance in high‑volume manufacturing.
The role emphasizes collaboration across teams, statistical design of experiments (DOE), and process qualification, with documentation of findings and supplier coordination.
#J-18808-LjbffrHybrid Advanced Packaging Engineer: Innovation & Process Lead in chandler at Unknown Company
This position is listed as full time and onsite.