Micron Technology, Inc is seeking a motivated SoC Physical Design Intern to support the HBM team in implementing advanced memory designs for AI and data center workloads.
You will gain hands-on experience with floorplanning, timing analysis, signoff flows, and automation using Python and Tcl, collaborating across architecture, RTL, verification, and signoff to deliver high‑performance, power‑efficient silicon.
#J-18808-LjbffrHBM SoC Physical Design Engineer Intern in folsom at Unknown Company
This position is listed as full time and onsite.